Waferpedia

Comparison ledger

0020 17484 PartversusFC-1800

Applied Materials 0020 17484 Part, Temescal FC-1800, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
0020 17484 PartApplied Materials
FC-1800Temescal
OEMApplied MaterialsTemescal
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17484 PartTemescal FC-1800
Specifications
ConfigurationBar, Cap Bank, Hdpcvd 300mm Ultima X[1]—
System type—Deposition system[2]
Spare parts kit—FC-1800 O-ring Spares Kit; replacements for all O-rings used on Temescal FC-1800 systems; part no. 0515-9270-0[2]
Shields kit—FC-1800 Shields Kit; includes main section shield and dome shield; part no. 0615-7071-0[2]
Tripod stand assembly—TP-8-20 Tripod Stand Assembly for Temescal FC-1800 system; used with TP-8-20 lift-off domes; part no. 0626-3934-0[3]
Planetary fixture—HSP-20 Planetary Fixture for Temescal FC-1800 system; used with HSP-20 planets; part no. 0615-8084-0[3]
TP-8-20 dome options—For the FC-1800 system, TP-8-20 domes are listed for 2-inch wafers (capacity 12), 3-inch wafers (capacity 17), and 100-mm wafers (capacity 13); dome diameter is 17.25 inches and spherical radius is 19.5 inches.[3]
HSP-20 planet options—For the FC-1800 system, HSP-20 planets are listed for 2-inch wafers (capacity 22), 3-inch wafers (capacity 12), 100-mm wafers (capacity 4 or high-capacity 6), 125-mm wafers (capacity 3 or high-capacity 4), and 150-mm wafers (capacity 2); planet diameter is 11.875 inches and spherical radius is 8.5 inches.[3]
Description—standard e-beam evaporator[5]
Crucible system—six-pocket crucible system[4]
Source pockets—three 15 cc pockets and three 7 cc pockets[6]
Substrate capacity—up to three 156 mm solar substrates or smaller sizes, including pieces[5]
Rotating substrate stage—7.5 inch diameter water-cooled rotating substrate stage[6]
Substrate stage speed—5 to 100 RPM[6]
Standard wafer capacity—one 6 inch diameter wafer or small pieces using standard spring clips[6]
Processes defined—Ti, Pt, Ag, and Al evaporation[5]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]web.archive.orgweb.archive.org
  4. [4]nanofabrication.nd.edunanofabrication.nd.edu
  5. [5]cores.research.asu.educores.research.asu.edu
  6. [6]semistarcorp.comsemistarcorp.com