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Comparison ledger

0041-26723 Bonded AssemblyversusM Feeder II

Applied Materials 0041-26723 Bonded Assembly, ASM M Feeder II, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyASM M Feeder II
Specifications
Configuration—Configured for Manual Panel Loading[1]
Bondhead Type—Single bondhead with 4 arms[1]
System performance - XY placement—± 0.4 mil (10 um) @ 3g[1]
System performance - Die rotation—±1° @ 3g[1]
System performance - Global array angle—±0.01o[1]
System performance - Bonding cycle—72 ms[1]
Die size—90 x 90 - 500 x 500 um[1]
Die thickness—3.5 x 3.5-19.7 x 19.7 mil / Min 50 um[1]
Input material—Standard JEDEC tray[1]
No. of tray handling—2[1]
Carrier size—Max 60 x 60 x 1.5mm (With 50 x 50mm effective bonding area)[1]
Wafer type—Foton ring[1]
Wafer ring size (OD)—7.33"[1]
Expanded wafer size—5.9"[1]
PR system - Image mode—Color[1]
PR system - Grey level—256 grey level[1]
Voltage—220 Vac, Single Phase[1]
Optional voltage—110 Vac[1]
Frequency—50/60 Hz[1]
Compressed air—6 bar[1]
Air consumption—700 LPM @ 6bar[1]
Vacuum pump—Option[1]
Full load current—24A @ 220V[1]
OEM—ASM[1]
Model—M Feeder II[1]
Configured for—manual panel loading[1]
XY placement—± 0.4 mil (10 um) @ 3g[1]
Die rotation—±1° @ 3g[1]
Global array angle—±0.01°[1]
Bonding cycle—72 ms[1]
PR image mode—Color[1]
PR grey level—256 grey level[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing