ASM

M Feeder II

Packaging & Bonding ASM M Feeder II family

Research Quality: 50% complete

ASM M Feeder II is a die sorter/bonder. ASM M Feeder II is configured for manual panel loading. ASM M Feeder II is configured for direct die placement onto a display panel system.^[1]^[2]

M Feeder II — Inventory photo — Fig. 01M Feeder IIInventory photo^[1]

Power

220 Vac, Single Phase^[1]

Vacuum

Option^[1]

What it is

The ASM M Feeder II is a die sorter and bonder for packaging and bonding work.^[1]^[2]

The ASM M Feeder II is configured for manual panel loading and direct die placement onto a display panel system.^[1]^[2]

How it works

The ASM M Feeder II uses a single bondhead with four arms.^[1]

Where it fits in the process flow

The ASM M Feeder II is configured for direct die placement onto a display panel system.^[1]^[2]

Applications

The ASM M Feeder II handles die thickness from 3.5 x 3.5-19.7 x 19.7 mil and a minimum of 50 um.^[1]

The ASM M Feeder II uses standard JEDEC trays as input material and supports two tray-handling positions.^[1]

What do the numbers mean?

Power & electrical4

Voltage: 220 Vac, Single Phase^[1]
Optional voltage: 110 Vac^[1]
Frequency: 50/60 Hz^[1]
Full load current: 24A @ 220V^[1]

Vacuum & pumping1

Vacuum pump: Option^[1]

Wafer handling4

Carrier size: Max 60 x 60 x 1.5mm (With 50 x 50mm effective bonding area)^[1]
Wafer type: Foton ring^[1]
Wafer ring size (OD): 7.33"^[1]
Expanded wafer size: 5.9"^[1]

Configuration & options26

Configured for Manual Panel Loading^[1]; Configured for Direct Die Placement onto Display Panel^[1]; System Performance:^[1]
Bondhead Type: Single bondhead with 4 arms^[1]
System performance - XY placement: ± 0.4 mil (10 um) @ 3g^[1]
System performance - Die rotation: ±1° @ 3g^[1]
System performance - Global array angle: ±0.01o^[1]
System performance - Bonding cycle: 72 ms^[1]
Die size: 90 x 90 - 500 x 500 um^[1]
Die thickness: 3.5 x 3.5-19.7 x 19.7 mil / Min 50 um^[1]
Input material: Standard JEDEC tray^[1]
No. of tray handling: 2^[1]
PR system - Image mode: Color^[1]
PR system - Grey level: 256 grey level^[1]
Compressed air: 6 bar^[1]
Air consumption: 700 LPM @ 6bar^[1]
OEM: ASM^[1]
Model: M Feeder II^[1]
Configured for: manual panel loading^[1]
Configured for: direct die placement onto a display panel system^[1]
XY placement: ± 0.4 mil (10 um) @ 3g^[1]
Die rotation: ±1° @ 3g^[1]
Global array angle: ±0.01°^[1]
Bonding cycle: 72 ms^[1]
PR image mode: Color^[1]
PR grey level: 256 grey level^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Voltage220 Vac, Single Phase^[1]
Optional voltage110 Vac^[1]
Frequency50/60 Hz^[1]
Vacuum pumpOption^[1]
Full load current24A @ 220V^[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the ASM M Feeder II?

The ASM M Feeder II is a die sorter and bonder.^[1]^[2]

What loading method does the ASM M Feeder II use?

The ASM M Feeder II is configured for manual panel loading.^[1]^[2]

What input material does the ASM M Feeder II accept?

The ASM M Feeder II accepts standard JEDEC trays.^[1]

What bondhead configuration does the ASM M Feeder II use?

The ASM M Feeder II uses a single bondhead with four arms.^[1]

Not publicly documented

The following facts about the M Feeder II are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the M Feeder II are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the M Feeder II are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the M Feeder II are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the M Feeder II are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the M Feeder II is not on record.
Answerable by: an OEM datasheet or a fab qualification report