Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Besi 2200 APM, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 2200 APMBesi |
|---|---|---|
| OEM | Applied Materials | Besi |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Besi 2200 |
| Cited variants | — |
|
| Specifications | ||
| Phase | — | 3 Phase[1] |
| Voltage | — | 400V[1] |
| Configuration | — | 50/60 Hz[1] |
| Equipment type | — | Bonder[2] |
| Make | — | Besi / Datacon[3] |
| Model | — | 2200 APM[3] |
| Machine type | — | High-accuracy multi-chip die bonder[4] |
| Application | — | Semiconductor packaging and bonding operations[2] |
| Applications | — | Die attach and flip chip applications[5] |
| Electrical | — | 3 Phase, 400V, 50/60 Hz[2] |
| Vintage | — | 2001[4] |
| Wafers handled | — | 12-inch wafers[5] |
| Integrated dispenser | — | Included[4] |
| Tool changer | — | Automatic tool changer[4] |
| Tooling | — | Application specific tooling[4] |
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