Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, ESI 5330, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 5330ESI |
|---|---|---|
| OEM | Applied Materials | ESI |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | ESI 5330 |
| Specifications | ||
| Rep Rate Range (kHz) | — | 30-70[1] |
| Max Work Surface Power (W) | — | 6.1[1] |
| Pulse Width (ns) | — | 80 @30kHz, 140 @70kHz[1] |
| Rep Rate Range | — | 30-70 kHz[1] |
| Max Work Surface Power | — | 6.1 W[1] |
| Pulse Width | — | 80 ns @ 30 kHz, 140 ns @ 70 kHz[1] |
| Year | — | 2004 vintage[1] |
| Laser Type | — | High power diode pumped, repetitively Q-switched Nd:YAG[2] |
| Wavelength | — | 355 nm[2] |
| Operating Mode | — | TEM oo (gaussian power distribution across the beam)[2] |
| Panel Size | — | 21 in x 25 in (533 mm x 635 mm)[2] |
| Resolution | — | < 0.00004 in (1 μm)[2] |
| Accuracy | — | ± 0.0008 in (± 20 μm)[2] |
| Model | — | 5330[1] |
| Make | — | ESI[1] |
| Device type | — | Laser[1] |
| Product type | — | UV Laser μVia Drill[2] |
| Application | — | High-quality microvias in small-geometry circuit boards and electronic packages[2] |
| Pulse repetition frequency | — | Up to 70 kHz[2] |
| Average power at work surface | — | > 5.7 W @ 30 kHz[2] |
| Pulsewidth | — | 60 nsec typical[2] |
| Panel size | — | 21” x 25” (533 mm x 635 mm)[2] |
| Control operating system | — | Real-time UNIX (LynxOS)[2] |
| Laser beam positioning type | — | Cross-axis with galvanometer[2] |
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