ESI
5330
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ESI 5330 is a UV laser μVia drill. The ESI 5330 is designed for high-quality microvias in small-geometry circuit boards and electronic packages. The ESI 5330 has a pulse repetition frequency of up to 70 kHz.[1]
What it is
How it works
The ESI 5330 uses a UV laser beam to ablate material and form microvias in dielectric and copper structures.[1][3]
The ESI 5330 uses a cross-axis laser-beam positioning type with galvanometer control, a cross-axis main stage, and a secondary XY deflection stage.[1]
The ESI 5330 uses a diode-pumped, repetitively Q-switched Nd:YAG laser operating at 355 nm with TEM00 output and a typical pulsewidth of 60 ns.[1]
Applications
The ESI 5330 is used for high-quality microvias in small-geometry circuit boards and electronic packages.[1]
What do the numbers mean?
Power & electrical6
Vacuum & pumping1
Optics & imaging6
Performance2
Control & software1
Configuration & options10
- Application
- High-quality microvias in small-geometry circuit boards and electronic packages[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of laser source does the ESI 5330 use?
The ESI 5330 uses a high-power diode-pumped, repetitively Q-switched Nd:YAG laser at 355 nm.[1]
What repetition rate does the ESI 5330 support?
The ESI 5330 has a pulse rate for via formation of 30 to 70 kHz and a pulse repetition frequency of up to 70 kHz.[1]
What panel size does the ESI 5330 handle?
The ESI 5330 has a panel size of 21 inches by 25 inches, with an autoloader option that allows a maximum panel size of 21.5 inches by 25 inches.[1]
What materials can the ESI 5330 process?
The ESI 5330 can cut copper and directly ablate non-reinforced dielectric and soldermask material.[1]
Not publicly documented
The following facts about the 5330 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 5330 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 5330 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 5330 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 5330 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 5330 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]pcbequipment.com — pcbequipment.compcbequipment.com
- [2]Inventory photo
- [3]ESI ~ — esi.com (Sep 2, 2005)web.archive.org
Last updated Oct 17, 2026.
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