Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Hesse & Knipps Bondjet LSB959, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | Bondjet LSB959Hesse & Knipps |
|---|---|---|
| OEM | Applied Materials | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Hesse & Knipps Bondjet LSB959 |
| Specifications | ||
| Machine type | — | Fully automatic heavy wire bonder[1] |
| Function | — | Thermosonic function[1] |
| Product line | — | Bondjet[1] |
| Laser source | — | IR fiber laser[2] |
| Laser power | — | Up to 130 W[2] |
| Bondtool tip temperature | — | 400-500 °C[2] |
| Interface temperature | — | 150-200 °C[2] |
| Frequency | — | 60 kHz[2] |
| Wire diameter | — | Cu: 300 μm – 500 μm[2] |
| Working area X | — | 370 mm[2] |
| Working area Y | — | 560 mm[2] |
| Working area Z | — | 42 mm[2] |
| P-rotation | — | 440°[2] |
| Footprint | — | 805 x 1634 x 1912 mm[2] |
| Weight | — | ca. 1300 kg[2] |
| Power supply | — | 230V AC[2] |
| Connectivity | — | Gigabit-Ethernet (TCP/IP), USB-Ports, HDMI, compressed air, vacuum, process gas[2] |
| Operation modes | — | Fully automatic or manual[2] |
| Process modes | — | Classic ultrasonic heavy wire bonding and thermosonic heavy wire bonding[2] |
| Laser safety class | — | Laser class 1[2] |
| Type | — | Fully automatic heavy wire bonder[1] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →