Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Hesse & Knipps Bondjet 820, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | Bondjet 820Hesse & Knipps |
|---|---|---|
| OEM | Applied Materials | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Hesse & Knipps Bondjet 820 |
| Specifications | ||
| Power | — | U 230V[1] |
| Configuration | — | 50/60 Hz[1] |
| Voltage | — | 230 V[2] |
| OEM | — | Hesse & Knipps (H&K)[1] |
| Model | — | Bondjet 820[1] |
| Equipment type | — | Bonder[1] |
| Description | — | Automatic fine wire wedge bonder[3] |
| Vintage | — | 2008[1] |
| Working area | — | 305 mm x 410 mm[3] |
| Axis repeatability | — | 1 micron at 3 sigma[3] |
| Wire diameter | — | 17.5 μm to 60 μm[3] |
| Axes | — | 4 axes (X, Y, Z, Theta)[3] |
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