Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Nordson 4000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 4000Nordson |
|---|---|---|
| OEM | Applied Materials | Nordson |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Nordson 4000 |
| Specifications | ||
| Configuration | — | Windows 11 operating system[1] |
| Manufacturer | — | Nordson / Dage[1] |
| Model | — | 4000[1] |
| Operating system | — | Windows 11[1] |
| Bond testing modes | — | Wire pull, ball shear, die shear, tweezer pull, vector pull[2] |
| Additional application modes | — | Bump pull[2] |
| Test force range (tensile) | — | 0–100 g, 0–1 kg, 0–10 kg[2] |
| Test force range (shear/thrust) | — | 250 g, 5 kg, 0–100 kg, 0–200 kg[2] |
| Test force range (tweezer pull) | — | 100 g, 5 kg[2] |
| Test force range (BGA ball pull) | — | 0–100 g, 0–5 kg[2] |
| Dimensions | — | 730 × 425 × 670 mm[2] |
| Weight | — | 45 kg[3] |
| Power supply | — | 100–240 V AC, 50/60 Hz[2] |
| Machine footprint | — | 425 mm W × 730 mm D × 670 mm H[3] |
| Z axis travel | — | 65 mm[3] |
| Z axis resolution | — | 0.125 micron[3] |
| Z axis maximum force | — | 10 kg pull at 5 mm/second[3] |
| Control software | — | Windows-based control software[2] |
| Sample compatibility | — | Bare silicon wafers (2", 4", 6", 8") and populated PCBs up to 300 × 300 mm[2] |
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