Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, SUSS MicroTec FC150, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | FC150SUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | SUSS MicroTec FC150 |
| Specifications | ||
| Equipment type | — | device bonder[1] |
| Use in source | — | used in the imprint process[1] |
| Use | — | used in the imprint process[1] |
| Process | — | Step & Stamp process to imprint structures[2] |
| Application | — | imprinting sub-micron structures in inherently conductive polyaniline[2] |
| Tool type | — | flip-chip bonder[3] |
| Chip-to-chip application size | — | up to 100 mm[3] |
| Chip-to-wafer application size | — | up to 200 mm[3] |
| Accuracy | — | ± 1 μm[3] |
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