Comparison ledger
Applied Materials 0720 06060 Part, KLA Flexus F 2320 I Stress Measurement, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0720 06060 PartApplied Materials | |
|---|---|---|
| OEM | Applied Materials | KLA |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | 6" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 1991 Vintage |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0720 06060 Part | KLA Flexus F 2320 I Stress Measurement |
| Specifications | ||
| Configuration | Contact Pin 24-20 Awg Crimp Gold Flash[1] | Dual Wavelength[2] |
| Software Version | — | 2.0[2] |
| Operating System | — | MS-DOS V6.22[2] |
| Voltage | — | 115V[2] |
| Current | — | 10A[2] |
| Wafer size | — | This system comes with an alignment/centering ring for a 6" wafer[2] |
| Wafer Sizes | — | 6 inch, 8 inch[2] |
| Vintage | — | 1991[2] |
| Measurement | — | Dual Wavelength[2] |
| Manufacturer | — | KLA[2] |
| Model | — | Flexus F 2320 I[2] |
| Wafer sizes | — | 6 in, 8 in[2] |
| Optics | — | Dual Wavelength[2] |
| Alignment/centering ring | — | Includes an alignment/centering ring for a 6" wafer[2] |
| 8-inch wafer alignment tool | — | Does not have any alignment tool for an 8" wafer[2] |
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