Comparison ledger
Applied Materials Centura Enabler Oxide, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Centura Enabler OxideApplied Materials | 110Tegal |
|---|---|---|
| OEM | Applied Materials | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Centura | Tegal 110 |
| Cited variants |
| |
| Specifications | ||
| Configuration | Server OS Type[2] | — |
| OEM | Applied Materials[5] | — |
| Model | Centura Enabler[5] | — |
| Equipment type | Oxide Etcher[5] | — |
| Server OS Type | 2008 Vintage[2] | — |
| Make | Applied Materials[5] | — |
| Product type | Oxide etcher[5] | — |
| Vintage (documented units) | 2008[1] | — |
| Server OS type (documented units) | 2008[2] | — |
| model | — | 110 SE[3] |
| application focus | — | process development applications[3] |
| process capability | — | deep silicon plasma etching[3] |
| capabilities | — | very high aspect ratio trench etch and profile control[3] |
| configuration | — | multiple configurations with minimum technical intervention[3] |
| System type | — | plasma etch system[6] |
| Supported components | — | MEMS and 3D-IC components[3] |
| Control capability | — | very high aspect ratio trench etch and profile control[6] |
| Physical description | — | compact[3] |
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