Comparison ledger
Applied Materials eMax CT Plus Dielectric, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | eMax CT Plus DielectricApplied Materials | 110Tegal |
|---|---|---|
| OEM | Applied Materials | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials eMax | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Alcatel ATH 1600 M Turbo Pump[2] | — |
| Bias | 13.5 MHz (Bias) & 2 MHz (LF Bias)[2] | — |
| LF Bias | Daihen RMN-50N1[2] | — |
| Source | Daihen AMN-30 H 60 MHz[2] | — |
| Gate Valve | Nor-Cal / NC-95-PP[2] | — |
| FIB | eFib, wFib[2] | — |
| Turbo Pump | Alcatel ATH 1600 M[2] | — |
| RF Match Box | Included[3] | — |
| RF Generator | Included[3] | — |
| Chamber Equip Cart | Included[2] | — |
| Type | Dielectric etch chamber[2] | — |
| Low-frequency bias unit | Daihen RMN-50N1[2] | — |
| Chamber equipment cart | Included[2] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[4] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[4] |
| Physical description | — | compact[1] |
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