Comparison ledger
Applied Materials P 5000 Cluster, Tegal 6550, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | P 5000 ClusterApplied Materials | 6550Tegal |
|---|---|---|
| OEM | Applied Materials | Tegal |
| Category | Etch | Etch |
| Wafer size | 100mm | 100mm |
| Process node | — | — |
| Introduced | — | 2000 |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2000 Patent announcement · 2001 Order announced |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials P 5000 Cluster | Tegal 6550 |
| Cited variants | — |
|
| Specifications | ||
| Chamber A | Metal etch, not usable (needs new chamber)[2] | — |
| Chamber B | Dielectric etch, fully functional[2] | — |
| Chamber C | Polysilicon etch, not functioning, gas flow issues, new helium seals required[2] | — |
| Chamber D | Not used, status unknown[2] | — |
| Configuration | With:[2] | — |
| Wafer size | 4-inch/100mm wafer kit[2] | 100mm–200mm[1] |
| Chamber Type | Cluster tool with four chambers[3] | — |
| Etch Type (Chambers A, B, C) | Magnetically-Enhanced Reactive Ion Etch (MERIE)[3] | — |
| Endpoint Detection | Optical endpoint detection[3] | — |
| Chamber A Function | Metal etch[2] | — |
| Chamber B Function | Dielectric etch[2] | — |
| Chamber C Function | Polysilicon etch[2] | — |
| Product type | — | etch reactor / plasma etch system[4] |
| Process target | — | non-volatile metal and metal oxide films[4] |
| Primary application | — | volume production of magnetic memory components such as MRAM and GMR devices[4] |
| Platform | — | full cluster tool technology[4] |
| Process capability | — | patented rinse-strip-rinse feature / process capability[4] |
| Chamber configuration | — | dual-chamber platform[5] |
| Plasma source | — | patented next-generation dual-frequency plasma source technology[4] |
| Plasma source (later material) | — | Spectra plasma source[5] |
| Available option | — | deposition shield[4] |
| Type | — | plasma etch reactor[4] |
| Processes | — | etching non-volatile metal and metal oxide films[4] |
| Plasma source technology | — | patented next-generation, dual-frequency plasma source technology[4] |
| Variant | — | Spectra plasma source[5] |
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