Waferpedia

Comparison ledger

200 PCUversusPurion H 200 High Current

Axcelis 200 PCU, Axcelis Purion H 200 High Current, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 PCUAxcelis
OEMAxcelisAxcelis
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2000 Vintage—
Control system——
Generation——
FamilyAxcelis NV GSD 200Axcelis Purion H 200 High Current
Cited variants
  • Fusion 200 PCU[1]
  • Fusion 200 PCU-P[2]
—
Specifications
P/NSC 4840 A[3]—
Frequency50 Hz[3]—
Phase3 Phase[3]—
Voltage400 V[3]—
Manufacturer—Axcelis[4]
Model—Purion H 200[4]
Tool type—High Current Implanter[4]
Wafer size—12 inch[4]
Tool description—single wafer high current implanter[5]
Maximum single charge energy range—up to 230 keV[5]
Maximum accel voltage—170 kV[5]
High-current beamline capability—greater than 20 mA of beam currents[5]
Wafer sizes—12 inch; 6 inch; 200 mm; 150 mm; 300 mm[5]

Plan your fab

Building a Ion Implantation process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]exapro.comexapro.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]Equipment inventory listing
  5. [5]axcelis.comaxcelis.com