Comparison ledger
Besi 2200 APM Multi-Chip, Branson 101-149-053 Gold Booster, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | |
|---|---|---|
| OEM | Besi | Branson |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2200 | Branson 101-149-053 Gold Booster |
| Specifications | ||
| Configuration | Non-functional spares[1] | 1:1.5[5] |
| Manufacturer | Besi[2] | Branson[6] |
| Model | 2200 APM Multi-Chip[2] | 101-149-053[6] |
| Equipment type | Multi-chip die bonder[2] | — |
| Machine type | Multi-Chip Heterogeneous Die Attach Platform[3] | — |
| Primary application | SiP, MCM & hybrid modules; sequential mixed die placement on a single substrate[3] | — |
| Die feeding options | 12-inch wafers, waffle packs, Gel-Pak trays, strip feeders[3] | — |
| Substrate carriers | Ceramic carriers, PCBs, lead frames, custom carriers, wafer substrates[3] | — |
| Integrated process station | Built-in dispensing: epoxy patterning, stamping, flux dipping; compatible with multi-viscosity materials[3] | — |
| Bonding processes | Epoxy attach, soft soldering, thermocompression, eutectic bonding; hot & cold processes[3] | — |
| Tool changer | Automatic tool magazine, on-the-fly nozzle / ejector swap, no manual interruption[3] | — |
| Vision & compensation | Fiducial alignment, bad die skip; thermal compensation to minimize long-run thermal drift[3] | — |
| Optional upgrades | Additional bond heads, heated bond tools, 3D metrology, UV curing module[3] | — |
| Production profile | R&D validation, low & medium volume runs; optimized for frequent product changeovers[3] | — |
| Target packages | RF modules, sensor packages, power hybrids, optical SiP assemblies[3] | — |
| Vintage | 2001[4] | — |
| Serial number | 1000024[4] | — |
| Integrated functions | Integrated dispenser, 12-inch wafer handling, automatic tool changer, and application specific tooling[4] | — |
| Type | — | Gold Booster[6] |
| Operating frequency | — | 20 kHz[7] |
| Gain | — | 1:1.5[6] |
| Mounting thread | — | 1/2-20[7] |
| Length | — | 5.4 in[7] |
| Gain ratio | — | 1:1.5[6] |
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