Comparison ledger
Besi 2200 APM Multi-Chip, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 10490West Bond | |
|---|---|---|
| OEM | Besi | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2200 | West Bond 10490 |
| Specifications | ||
| Configuration | Non-functional spares[1] | — |
| Manufacturer | Besi[2] | West Bond[5] |
| Model | 2200 APM Multi-Chip[2] | 10490[5] |
| Equipment type | Multi-chip die bonder[2] | — |
| Machine type | Multi-Chip Heterogeneous Die Attach Platform[3] | — |
| Primary application | SiP, MCM & hybrid modules; sequential mixed die placement on a single substrate[3] | — |
| Die feeding options | 12-inch wafers, waffle packs, Gel-Pak trays, strip feeders[3] | — |
| Substrate carriers | Ceramic carriers, PCBs, lead frames, custom carriers, wafer substrates[3] | — |
| Integrated process station | Built-in dispensing: epoxy patterning, stamping, flux dipping; compatible with multi-viscosity materials[3] | — |
| Bonding processes | Epoxy attach, soft soldering, thermocompression, eutectic bonding; hot & cold processes[3] | — |
| Tool changer | Automatic tool magazine, on-the-fly nozzle / ejector swap, no manual interruption[3] | — |
| Vision & compensation | Fiducial alignment, bad die skip; thermal compensation to minimize long-run thermal drift[3] | — |
| Optional upgrades | Additional bond heads, heated bond tools, 3D metrology, UV curing module[3] | — |
| Production profile | R&D validation, low & medium volume runs; optimized for frequent product changeovers[3] | — |
| Target packages | RF modules, sensor packages, power hybrids, optical SiP assemblies[3] | — |
| Vintage | 2001[4] | — |
| Serial number | 1000024[4] | — |
| Integrated functions | Integrated dispenser, 12-inch wafer handling, automatic tool changer, and application specific tooling[4] | — |
| Description | — | Convertible bonder, wedge to ball[6] |
| Tool type | — | Convertible bonder[7] |
| Bonding modes | — | Wedge bonding and ball bonding[7] |
| Use | — | Wire bonding[7] |
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