Waferpedia

Comparison ledger

18 D SurfaceversusDAD 322 Automatic Dicing

Blanchard 18 D Surface, Disco DAD 322 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DAD 322 Automatic Dicing
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[2]—
Model18 D[2]—
Asset #153970[1]—
Power416 V, 3 phase[2]—
Blade inner diameter—40 mm[4]
Blade outer diameter—>49.4 mm[4]
Maximum cutting depth—(O.D. - 49.4 mm) / 2 mm[4]
Blade thickness range—15 µm to 200 µm[4]
Wafer mounting—UV tape[4]
Cooling—Deionized water[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]hope.site.nthu.edu.twhope.site.nthu.edu.tw