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Disco

DAD 322 Automatic Dicing

Dicing & Grinding
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DiscoDAD 322 Automatic Dicing
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What it is

The Disco DAD 322 is an automatic dicing saw used for wafer singulation in semiconductor manufacturing. The machine is designed to cut wafers into individual chips.[2][1]

How it works

The Disco DAD 322 can only install hubless blades with an inner diameter of 40 mm and an outer diameter greater than 49.4 mm. The maximum depth the blade can cut into the target without touching unintended parts is (outer diameter minus 49.4 mm) divided by 2 mm. The blade thicknesses available range from 15 µm to 200 µm. The machine uses deionized water to cool the blade during cutting. The target is mounted using UV tape, and targets that are vulnerable to UV light or water are not recommended unless alternative tape is provided.[1]

Applications

The Disco DAD 322 supports both cut-through and surface cutting operations. The choice of cutting method depends on the target material, cut depth, feed rate, rotation speed, and cut shape.[1]

What do the numbers mean?

Wafer handling1

Wafer mounting
UV tape[1]
Accurate?

Dimensions & facilities1

Maximum cutting depth
(O.D. - 49.4 mm) / 2 mm[1]
Accurate?

Configuration & options4

Blade inner diameter
40 mm[1]
Accurate?
Blade outer diameter
>49.4 mm[1]
Accurate?
Blade thickness range
15 µm to 200 µm[1]
Accurate?
Cooling
Deionized water[1]
Accurate?
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What blade types can be installed on the DAD 322?

Only hubless blades with an inner diameter of 40 mm can be installed.[1]

What is the maximum cutting depth the DAD 322 can achieve?

The maximum depth the blade can cut into the target without touching unintended parts is (outer diameter minus 49.4 mm) divided by 2 mm.[1]

What cooling medium does the DAD 322 use?

Deionized water is used to cool the blade while cutting.[1]

What type of tape is used to mount the target?

UV tape is used to mount the target. Targets vulnerable to UV light are not recommended unless alternative tape with both sides greater than 220 mm is provided.[1]

Not publicly documented

The following facts about the DAD 322 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 322 Automatic Dicing are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the DAD 322 Automatic Dicing are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the DAD 322 Automatic Dicing are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DAD 322 Automatic Dicing are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DAD 322 Automatic Dicing is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]hope.site.nthu.edu.twhope.site.nthu.edu.twhope.site.nthu.edu.tw
  2. [2]Equipment inventory listing
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Last updated Aug 20, 2026.

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