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18 D SurfaceversusDFD 6340 Automatic Dicing

Blanchard 18 D Surface, Disco DFD 6340 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DFD 6340
Specifications
Voltage416 V[1]220 Vac[5]
Phase3 Phase[1]3 Phase[5]
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[2]Disco[4]
Model18 D[2]DFD 6340[4]
Asset #153970[1]—
Power416 V, 3 phase[2]—
Configuration—Missing ZI motor[4]
Machine type—Automatic dicing saw[4]
Wafer size—8 inch[7]
Electrical configuration—3 Phase, 3 Wire + Ground, 220 Vac, 50/60 Hz[5]
Example unit vintage—2013[4]
OEM—Disco[4]
Equipment type—Automatic Dicing Saw[4]
Electrical—3 Phase[8]
Vintage—2013[4]
Spindle Power Options—1.2 / 1.8 / 2.2 kW[9]
X-axis Cutting Range—210 mm[9]
X-axis Cutting Speed—0.1-600 mm/s[9]
Y1 / Y2 Axis Cutting Range—210 mm[9]
Y-axis Index Step—0.0001 mm[9]
Z-axis Repeatability—0.001 mm[9]
Main Process—Wafer Dicing / Package Singulation[9]

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Sources (9)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]Equipment inventory listing
  8. [8]Equipment inventory listing
  9. [9]inventory listing