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18 D SurfaceversusDFD 6362 Automatic Dicing

Blanchard 18 D Surface, Disco DFD 6362 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DFD
Specifications
Voltage416 V[1]308 - 415 VAC +/- 10%, 3 Phase[5]
Phase3 Phase[1]3 Phase[4]
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[2]Disco[4]
Model18 D[2]DFD 6362[4]
Asset #153970[1]—
Power416 V, 3 phase[2]3 Phase - 3 Wire + Ground - 50/60 Hz - 200-240 Vac[4]
Configuration—3 Wire + Ground[4]
Full Load Current—9 A[6]
Machine Main Breaker Rating—20 A[6]
Largest Load—4 A[6]
Equipment type—Automatic Dicing Saw[6]
Vintage—2023[4]
Frequency—50/60 Hz[5]
Type—Fully Automatic Dicing Saw[7]
Max. workpiece size—Φ300 mm[7]
Wafer size—300mm[8]
Electrical phase—3 Phase[4]
Standard spindle—1.2 kW spindle[8]
Optional spindle—1.8 kW / 2.2 kW spindle[8]

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Sources (8)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]waferpedia.comwaferpedia.com
  7. [7]disco.co.jpdisco.co.jp
  8. [8]agsemiconductor.comagsemiconductor.com