Disco
DFD 6362 Automatic Dicing
The Disco DFD 6362 Automatic Dicing Saw is a fully automatic dicing saw. The Disco DFD 6362 Automatic Dicing Saw is specified for Φ300 mm wafers. The Disco DFD 6362 Automatic Dicing Saw has a maximum workpiece size of Φ300 mm.[1][2]
What it is
The Disco DFD6362 is a fully automatic dicing saw. The DFD6362 is part of DISCO's dicing saw product line. The DFD6362 is configured as a dual-spindle machine with a cassette-to-cassette flow. The DFD6362 is specified for workpieces up to Φ300 mm.[1]
How it works
The DFD6362 uses a lower arm to move the workpiece from the cassette to the pre-alignment stage. The DFD6362 then moves the workpiece to the chuck table for cutting. The DFD6362 uses an upper arm to move the workpiece to the spinner table for cleaning and drying. The DFD6362 returns the workpiece to the cassette after processing.[1]
The DFD6362 offers an optional Automatic Blade Changer that automates blade replacement and precut procedures after blade breakage and at the end of blade life. The optional Automatic Blade Changer replaces a blade in sixty seconds. The optional Automatic Blade Changer scans a 2D barcode on the blade backside to identify blade type during replacement. The DFD6362 also offers advanced graphical operation software with operation buttons on the same screen as the microscope image.[1]
Where it fits in the process flow
General reference — not yet source-verifiedA dicing saw operates in the wafer singulation stage near the end of semiconductor manufacturing. The dicing step follows front-end wafer fabrication and usually follows wafer mount preparation for sawing. The dicing step precedes die pick, package assembly, or other downstream device handling steps.
Applications
General reference — not yet source-verifiedDicing saws are used to separate individual die from processed wafers for later assembly. Dicing saws are applied to semiconductor devices and other substrates that are patterned into discrete chips before packaging or module integration.
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Phase3 Phase[3]
- Configuration50/60 Hz[3]
- Voltage308 - 415 VAC +/- 10%, 3 Phase[4]
- Power3 Phase - 3 Wire + Ground - 50/60 Hz - 200-240 Vac[3]
- Voltage308 - 415 VAC +/- 10%[7]
- Frequency50/60 Hz[4]
- Voltage200-240 Vac[3]
- Electrical phase3 Phase[3]
- Standard spindle1.2 kW spindle[2]
- Optional spindle1.8 kW / 2.2 kW spindle[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of machine is the Disco DFD6362?
The Disco DFD6362 is a fully automatic dicing saw.[1]
What maximum workpiece size does the DFD6362 support?
The DFD6362 supports a maximum workpiece size of Φ300 mm.[1]
How does the DFD6362 move a wafer through processing?
The DFD6362 uses a lower arm to move the workpiece from the cassette to the pre-alignment stage and then to the chuck table for cutting. The DFD6362 uses an upper arm to move the workpiece to the spinner table for cleaning and drying, and the lower arm returns the workpiece to the cassette.[1]
Does the DFD6362 offer automatic blade changing?
The DFD6362 offers an optional Automatic Blade Changer that automates blade replacement and precut procedures after blade breakage and at the end of blade life.[1]
What are the equipment dimensions and weight of the DFD6362?
The DFD6362 has equipment dimensions of 1,200 × 1,550 × 1,800 mm and an equipment weight of approximately 2,050 kg.[1]
Not publicly documented
The following facts about the DFD 6362 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6362 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6362 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6362 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 6362 Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 6362 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]disco.co.jp — disco.co.jpdisco.co.jp
- [2]agsemiconductor.com — agsemiconductor.comagsemiconductor.com
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]waferpedia.comwaferpedia.com
Last updated Oct 20, 2026.
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