Comparison ledger
Blanchard 18 D Surface, Disco DFG 8540 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 18 D SurfaceBlanchard | DFG 8540 BackDisco |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 18 D Surface | Disco DFG |
| Specifications | ||
| Voltage | 416 V[1] | 200 VAC[4] |
| Phase | 3 Phase[1] | 3 Phase[4] |
| Cycles | 50[1] | — |
| Control Voltage | 110[1] | — |
| Make | Blanchard[2] | Disco[4] |
| Model | 18 D[2] | DFG 8540[4] |
| Asset # | 153970[1] | — |
| Power | 416 V, 3 phase[2] | — |
| Configuration | — | 6" / 8" Universal Table for IGBT Si[4] |
| Full Load | — | 54 A[4] |
| Equipment type | — | Back Grinder[4] |
| Wafer sizes | — | 6, 8 inch[4] |
| Grinding method | — | Anomalous in-feed grinding with wafer rotation[5] |
| Supported workpiece size | — | Φ8 inch (Φ4, 5, 6, 8 inch with universal chuck table use)[5] |
| Grinding wheels | — | Φ200 mm Diamond Wheel[5] |
| Spindle rated output | — | 4.2 kW[5] |
| Rotation speed range | — | 1,000 to 7,000 min-1[5] |
| Equipment dimensions (W × D × H) | — | 1,200 × 2,670 × 1,800 mm[5] |
| Equipment weight | — | Approx. 3,100 kg[5] |
| Processing capability | — | Large diameter grinding and thin-finish grinding[6] |
| Thin wafer handling | — | Ultra-thin wafer handling to 100 µm and less[6] |
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