Comparison ledger
Blanchard 20 36 Surface, Disco DAD641, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 20 36 SurfaceBlanchard | DAD641Disco |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 20 36 Surface | Disco DAD641 |
| Specifications | ||
| Configuration | With new Elecro-Matic Neutrol II Magnetic Chuck Control[1] | — |
| Magnetic Chuck Control | Electro-Matic Neutrol II[1] | — |
| Type | surface grinder[1] | — |
| Application | dicing and grinding[2] | — |
| Magnetic chuck control | Electro-Matic Neutrol II Magnetic Chuck Control[2] | — |
| Condition note | low hours[1] | — |
| Tool type | — | Dicing saw[3] |
| Location | — | Backend Lab[3] |
| Tool name | — | Disco DAD641[4] |
| Blade thickness options | — | 0.250 mm and 0.090 mm[5] |
| Tape thickness options | — | 130 μm (blue tape) and 160 μm (UV tape)[5] |
| Substrate dicing capability | — | 5×5 mm2 pieces[6] |
| Use | — | Wafer dicing[4] |
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