Comparison ledger
Blanchard 20 36 Surface, Disco DFL 7340 Stealth Laser Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 20 36 SurfaceBlanchard | |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 20 36 Surface | Disco DFL 7340 |
| Specifications | ||
| Configuration | With new Elecro-Matic Neutrol II Magnetic Chuck Control[1] | Power supply removed[3] |
| Magnetic Chuck Control | Electro-Matic Neutrol II[1] | — |
| Type | surface grinder[1] | — |
| Application | dicing and grinding[2] | — |
| Magnetic chuck control | Electro-Matic Neutrol II Magnetic Chuck Control[2] | — |
| Condition note | low hours[1] | — |
| OEM | — | Disco[4] |
| Model | — | DFL7340[4] |
| Process area | — | Packaging[4] |
| Purpose | — | Laser Stealth dicing of Si wafers[5] |
| Applications field | — | Contact-less dicing of Silicon wafers PICs, MEMS, BIO-MEMS and Semiconductor non-wet dicing[5] |
| Wavelength | — | 1342 nm[4] |
| Maximum sample diameter | — | 200 mm[4] |
| Wafer size | — | 200 mm or smaller[5] |
| Compatible materials | — | Si wafers only[4] |
| Dicing orientation | — | Topside or backside (through tape) dicing possible[4] |
| Position accuracy | — | 3 µm[5] |
| Feeding speed | — | 1.0–1000 mm/s[5] |
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