Comparison ledger
Blanchard 22 AD 42, Disco DFG 8540 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 22 AD 42Blanchard | DFG 8540 BackDisco |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 22 AD 42 | Disco DFG |
| Specifications | ||
| Phase | 3 Phase[1] | 3 Phase[2] |
| Frequency | 60 Hz[1] | — |
| Voltage | 120 Vac[1] | 200 VAC[2] |
| Configuration | No coolant tank[1] | 6" / 8" Universal Table for IGBT Si[2] |
| Full Load | — | 54 A[2] |
| Make | — | Disco[2] |
| Model | — | DFG 8540[2] |
| Equipment type | — | Back Grinder[2] |
| Wafer sizes | — | 6, 8 inch[2] |
| Grinding method | — | Anomalous in-feed grinding with wafer rotation[3] |
| Supported workpiece size | — | Φ8 inch (Φ4, 5, 6, 8 inch with universal chuck table use)[3] |
| Grinding wheels | — | Φ200 mm Diamond Wheel[3] |
| Spindle rated output | — | 4.2 kW[3] |
| Rotation speed range | — | 1,000 to 7,000 min-1[3] |
| Equipment dimensions (W × D × H) | — | 1,200 × 2,670 × 1,800 mm[3] |
| Equipment weight | — | Approx. 3,100 kg[3] |
| Processing capability | — | Large diameter grinding and thin-finish grinding[4] |
| Thin wafer handling | — | Ultra-thin wafer handling to 100 µm and less[4] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →