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101-149-053 Gold Boosterversus5330

Branson 101-149-053 Gold Booster, ESI 5330, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
5330ESI
OEMBransonESI
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterESI 5330
Specifications
Configuration1:1.5[1]—
ManufacturerBranson[2]—
Model101-149-053[2]5330[4]
TypeGold Booster[2]—
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
Rep Rate Range (kHz)—30-70[4]
Max Work Surface Power (W)—6.1[4]
Pulse Width (ns)—80 @30kHz, 140 @70kHz[4]
Rep Rate Range—30-70 kHz[4]
Max Work Surface Power—6.1 W[4]
Pulse Width—80 ns @ 30 kHz, 140 ns @ 70 kHz[4]
Year—2004 vintage[4]
Laser Type—High power diode pumped, repetitively Q-switched Nd:YAG[5]
Wavelength—355 nm[5]
Operating Mode—TEM oo (gaussian power distribution across the beam)[5]
Panel Size—21 in x 25 in (533 mm x 635 mm)[5]
Resolution—< 0.00004 in (1 μm)[5]
Accuracy—± 0.0008 in (± 20 μm)[5]
Make—ESI[4]
Device type—Laser[4]
Product type—UV Laser μVia Drill[5]
Application—High-quality microvias in small-geometry circuit boards and electronic packages[5]
Pulse repetition frequency—Up to 70 kHz[5]
Average power at work surface—> 5.7 W @ 30 kHz[5]
Pulsewidth—60 nsec typical[5]
Panel size—21” x 25” (533 mm x 635 mm)[5]
Control operating system—Real-time UNIX (LynxOS)[5]
Laser beam positioning type—Cross-axis with galvanometer[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]inventory listing
  5. [5]pcbequipment.compcbequipment.com