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101-149-053 Gold Boosterversus4000

Branson 101-149-053 Gold Booster, Nordson 4000, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
4000Nordson
OEMBransonNordson
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterNordson 4000
Specifications
Configuration1:1.5[1]Windows 11 operating system[4]
ManufacturerBranson[2]Nordson / Dage[4]
Model101-149-053[2]4000[4]
TypeGold Booster[2]—
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
Operating system—Windows 11[4]
Bond testing modes—Wire pull, ball shear, die shear, tweezer pull, vector pull[5]
Additional application modes—Bump pull[5]
Test force range (tensile)—0–100 g, 0–1 kg, 0–10 kg[5]
Test force range (shear/thrust)—250 g, 5 kg, 0–100 kg, 0–200 kg[5]
Test force range (tweezer pull)—100 g, 5 kg[5]
Test force range (BGA ball pull)—0–100 g, 0–5 kg[5]
Dimensions—730 × 425 × 670 mm[5]
Weight—45 kg[6]
Power supply—100–240 V AC, 50/60 Hz[5]
Machine footprint—425 mm W × 730 mm D × 670 mm H[6]
Z axis travel—65 mm[6]
Z axis resolution—0.125 micron[6]
Z axis maximum force—10 kg pull at 5 mm/second[6]
Control software—Windows-based control software[5]
Sample compatibility—Bare silicon wafers (2", 4", 6", 8") and populated PCBs up to 300 × 300 mm[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]inventory listing
  5. [5]instrumenthive.cominstrumenthive.com
  6. [6]americantec.comamericantec.com