Comparison ledger
Branson 101-149-053 Gold Booster, SUSS MicroTec FC150, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | FC150SUSS MicroTec |
|---|---|---|
| OEM | Branson | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | SUSS MicroTec FC150 |
| Specifications | ||
| Configuration | 1:1.5[1] | — |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | — |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Equipment type | — | device bonder[4] |
| Use in source | — | used in the imprint process[4] |
| Use | — | used in the imprint process[4] |
| Process | — | Step & Stamp process to imprint structures[5] |
| Application | — | imprinting sub-micron structures in inherently conductive polyaniline[5] |
| Tool type | — | flip-chip bonder[6] |
| Chip-to-chip application size | — | up to 100 mm[6] |
| Chip-to-wafer application size | — | up to 200 mm[6] |
| Accuracy | — | ± 1 μm[6] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →