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Comparison ledger

100versusNX 32

CEE 100, Ismeca NX 32, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
100CEE
NX 32Ismeca
OEMCEEIsmeca
CategoryLithographyLithography
Wafer size6"1 x Tube, 2 x Wafer
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 100Ismeca NX 32
Cited variants
Specifications
Tool typeSpray Developer[1]—
Accepts wafer sizeup to 6" wafers[3]—
Programmable programs10 programs[3]—
Steps per programup to 10 steps[3]—
Programmable step parametersAcceleration, Speed, Time[3]—
Associated documentCEE Model 100CB Spinner.doc[3]—
Wafer sizeUp to 6 inches[3]1 x Tube, 2 x Wafer[5]
Programs10 programs each with up to 10 steps[3]—
Control parametersAcceleration, Speed, Time[3]—
Equipment typeSpin coater[4]Scanner[6]
Programming10 programs; up to 10 steps per program[3]—
Step parametersAcceleration, speed, time[3]—
Configuration—1 x Tube, 2 x Wafer[5]
Make—Ismeca[6]
Model—NX 32[6]
Wafer size hint—1 x Tube, 2 x Wafer[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]web.archive.orgweb.archive.org
  3. [3]nanofab.utah.edunanofab.utah.edu
  4. [4]nanofab.utah.edunanofab.utah.edu
  5. [5]inventory listing
  6. [6]Equipment inventory listing