Comparison ledger
CEE 1000 Hot Plate, Heller 1809 MK 5, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1809 MK 5Heller | |
|---|---|---|
| OEM | CEE | Heller |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 1000 Hot Plate | Heller 1809 MK 5 |
| Specifications | ||
| Configuration | 4"[1] | — |
| Type | Hot Plate[1] | — |
| Wafer Size | 4 inch[1] | — |
| OEM | — | Heller[2] |
| Model | — | 1809 MK 5[2] |
| Equipment type | — | Reflow oven[2] |
| Category | — | Thermal / Diffusion[3] |
| Description | — | SMT reflow soldering oven[4] |
| Overall length | — | 183 in[4] |
| Max PCB width | — | 22 in[4] |
| Heating zones | — | 9[4] |
| Cooling zones | — | 2[4] |
| Dimensions | — | 465 x 137 x 160 cm[5] |
| Heated length | — | 254 cm[5] |
| Typical power consumption | — | 7.5 - 16 kW[5] |
| Max conveyor speed | — | 188 cm/min[5] |
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