Waferpedia

Comparison ledger

1000 Hot PlateversusHS 20 Diffusion

CEE 1000 Hot Plate, Varian HS 20 Diffusion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
OEMCEEVarian
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 1000 Hot PlateVarian HS 20 Diffusion
Specifications
Configuration4"[1]—
TypeHot Plate[1]Diffusion pump[3]
Wafer Size4 inch[1]—
Model—HS 20[2]
Cooling method—Water-cooled[3]
Pumping speed, maximum, air—17,500 l/s[4]
Pumping speed, maximum, helium—22,000 l/s[4]
Inlet flange—20" ASA[5]
Foreline flange—ISO63-K[5]
Power—480 VAC, 3-Ø[5]
Oil capacity—4.70 liters[5]
Weight—264 kg[5]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]manualslib.commanualslib.com
  4. [4]idealvac.comidealvac.com
  5. [5]lesker.comlesker.com