Waferpedia

Comparison ledger

200 Spinversus120 Automated Coater Processing

CEE 200 Spin, EV Group 120 Automated Coater Processing, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMCEEEV Group
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200EV Group 120 Automated Coater Processing
Specifications
Phase1 Phase[1]3 Phase[3]
TypeSpin Coater[1]—
Model200[1]—
MakeCEE[1]—
Wafer Sizes8 inch[1]—
Configuration1 Phase[1]50/60 Hz[3]
Equipment typeSpin Coater[1]—
Spin speed5000 rpm[2]—
Substrate supportFlat substrates up to 200 mm or fragments[2]—
Substrate thickness max12 mm[2]—
Coating thicknessUniform coating thickness up to 100 µm[2]—
Wafer sizes—6 inch, 8 inch[3]
Frequency—50/60 Hz[3]
Wiring configuration—4 Wire + GND[3]
Vintage—2015[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]amolf.nlamolf.nl
  3. [3]inventory listing