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Comparison ledger

200 SpinversusRF 300 A Photo Track

CEE 200 Spin, SCREEN RF 300 A Photo Track, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMCEESCREEN
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200SCREEN RF 300 A Photo Track
Specifications
Phase1 Phase[1]—
TypeSpin Coater[1]—
Model200[1]RF 300 A[3]
MakeCEE[1]SCREEN / DNS[3]
Wafer Sizes8 inch[1]—
Configuration1 Phase[1]Modifications:[3]
Equipment typeSpin Coater[1]—
Spin speed5000 rpm[2]—
Substrate supportFlat substrates up to 200 mm or fragments[2]—
Substrate thickness max12 mm[2]—
Coating thicknessUniform coating thickness up to 100 µm[2]—
Robot Change—IHU, MHU (2), BHU[3]
Bake—CP (6), FRHP (7)[3]
Modifications—Robot Change: IHU, MHU (2), BHU; Bake: CP (6), FRHP (7); Loadport (10); Cleanbooth; SC Cup Parts (2) (change and retrofit); SD Cup Parts, Nozzle (2) (change and retrofit); 10 L Nowpack Cabinet; ETU-Cab; Resist 8 High Viscosity (140 cp); Low Height Mod (Top Module Separation); BARC/Resist Separation Drain; Facility Connection Parts (change and retrofit); Power BOX Mod Parts (change and retrofit); Fire Suppression[3]
Resist 8 High Viscosity—140 cp[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]amolf.nlamolf.nl
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com