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Comparison ledger

200 SpinversusPC Spray

CEE 200 Spin, Specialty Coating Systems PC Spray, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
PC SpraySpecialty Coating Systems
OEMCEESpecialty Coating Systems
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200Specialty Coating Systems (SCS) PC Spray
Specifications
Phase1 Phase[1]1 Phase[3]
TypeSpin Coater[1]—
Model200[1]PC[3]
MakeCEE[1]—
Wafer Sizes8 inch[1]—
Configuration1 Phase[1]50/80 Hz[3]
Equipment typeSpin Coater[1]—
Spin speed5000 rpm[2]—
Substrate supportFlat substrates up to 200 mm or fragments[2]—
Substrate thickness max12 mm[2]—
Coating thicknessUniform coating thickness up to 100 µm[2]—
OEM—Specialty Coating Systems (SCS)[3]
Tool name—PC Spray Coater[3]
Power frequency—50/80 Hz[3]
Category—Resist Processing[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]amolf.nlamolf.nl
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com