Waferpedia

Comparison ledger

200 Spinversus8626 Photoresist

CEE 200 Spin, SVG 8626 Photoresist, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMCEESVG
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200SVG 8626
Specifications
Phase1 Phase[1]—
TypeSpin Coater[1]—
Model200[1]8626[3]
MakeCEE[1]—
Wafer Sizes8 inch[1]—
Configuration1 Phase[1]Cassette to cassette[3]
Equipment typeSpin Coater[1]Photo Resist Coaters[4]
Spin speed5000 rpm[2]—
Substrate supportFlat substrates up to 200 mm or fragments[2]—
Substrate thickness max12 mm[2]—
Coating thicknessUniform coating thickness up to 100 µm[2]—
Wafer Size—6 inch[3]
Number of Coats—2 coat[3]
Pumps—Excluded[3]
Track Type—Dual track[4]
Hotplates—Included[4]
OEM—SVG[3]
Wafer sizes—6 inch[3]
Coat count—2 coat[3]
Description—Dual Track Photoresist Coater With Hotplates[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]amolf.nlamolf.nl
  3. [3]inventory listing
  4. [4]jmind.comjmind.com