Comparison ledger
CEE 300 Bake Plate, YES 450 PB 12 Polyimide, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | CEE | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 300 Bake Plate | YES 450 |
| Cited variants | — | |
| Specifications | ||
| Wafer size | up to 300mm wafer[2] | Capacity is two 25 wafer cassettes in a batch process (50 wafers at a time) - 300mm FOUP[7] |
| Software | Internal OS[2] | — |
| Voltage | 208V[2] | 208V, 3 Phase 50/60 Hz, 40 amps[7] |
| Max Substrate Size | 300mm round or 12" x 12" square[1] | — |
| Min Substrate Size | 4 inch round[1] | — |
| Max Temperature | 300°C (400°C optional)[1] | — |
| Temperature Resolution | 0.1°C[1] | — |
| Temperature Uniformity | ±0.3% across working area[1] | — |
| Smart Pin Height Range | 0-19 mm[1] | — |
| Weight (machine only) | 146 lb (66.2 kg)[3] | — |
| Dimensions | 18" H x 18.75" W x 26.25" D[3] | — |
| Power | 3100-4100 watts[3] | 208V, 3 Phase 50/60 Hz, 40 amps[8] |
| Exhaust Port | 2" (50.8mm) OD[3] | — |
| Vacuum | 2" (50.8mm) OD[5] | Alternate vacuum valve for process vacuum[8] |
| Temperature range | ambient to 300°C (400°C optional)[6] | — |
| Bake methods | contact, vacuum and proximity[6] | — |
| Smart Pin height range | 0 to 19 mm, programmed in 0.1 mm increments[6] | — |
| Weight | 146 lb (66.2 kg) excluding accessories[6] | — |
| Nitrogen for proximity baking | 35 psi (241 kPa)[6] | — |
| Exhaust | 2" OD[6] | — |
| Chamber Material | — | 316L Stainless Steel[7] |
| Operation Temperature | — | ambient to 450°C (option high temp version: Ambient to 550°()[7] |
| Process Gas Inputs | — | 1 standard up to 3 optional[7] |
| Configuration | — | Preheated N, (Process Gas)[7] |
| Mass Flow Controllers | — | optional, up to 3[7] |
| Laminar Flow Filter | — | 100 micron Mott'" plate filter[7] |
| Cleanliness | — | particle reduction in most applications[7] |
| OEM | — | YES[8] |
| Model | — | 450 PB 12[8] |
| Category | — | Thermal / Diffusion[8] |
| Capacity | — | Two 25-wafer cassettes in a batch process (50 wafers at a time)[7] |
| FOUP compatibility | — | 300mm FOUP[7] |
| Wafer handling | — | Uses wafer cassette; wafers are manually brought to the machine and loaded inside[7] |
| Operation temperature | — | Ambient to 450°C[7] |
| Gas delivery | — | 1 standard up to 3 optional[8] |
| Process gas | — | Preheated N2[7] |
| Vacuum plumbing | — | VCR[8] |
| Number of Recipes | — | 8 temperature profiles (up to 200 with YES - DAQ-LR option)[7] |
| Temperature | — | Ambient to 450°C with LED temperature and set point displays[7] |
| Oxygen Concentration | — | 10 ppm over background[7] |
| High-temperature option | — | Ambient to 550°C[7] |
| Controller | — | PLC controller[7] |
| Operator interface | — | Color touch screen operator interface[7] |
| Temperature uniformity | — | +/- 5.0°C at dwell after all temperature points have stabilized for 15 minutes (empty chamber at pressures above 50 torr)[7] |
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