CEE
300 Bake Plate
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The CEE 300 Bake Plate is a semiconductor wafer bake plate for up to 300mm wafers. The CEE 300 Bake Plate supports recipe-controlled thermal processing. The CEE 300 Bake Plate uses DataStream logging.[1]
Wafer size
300mm
Power
208V[2]
Vacuum
2" (50.8mm) OD[4]
Performance
±0.3% across working area[3]
Optics
0.1°C[3]
What it is
General reference — not yet source-verifiedBake plates are thermal processing tools used to heat substrates on a controlled hot surface. Bake plates are commonly used in semiconductor and microfabrication lines around lithography and thin film workflows where a short, repeatable thermal step is needed.
How it works
General reference — not yet source-verifiedBake plates transfer heat from a temperature-controlled plate into the substrate for a timed process step. Bake plates can be run in direct contact or with a small controlled gap when the process calls for different heat transfer behavior or reduced backside contact.
Where it fits in the process flow
General reference — not yet source-verifiedBake plates are typically placed around coating, exposure, and development steps in microfabrication flows. Bake plates commonly serve as short thermal modules between wet-process steps to condition films, remove solvent, stabilize patterns, or prepare substrates for the next operation.
Applications
General reference — not yet source-verifiedBake plates are used for controlled heating steps in wafer and substrate processing. Bake plates are commonly applied to photoresist and other thin-film processes that require drying, solvent removal, thermal conditioning, or post-process stabilization.
What do the numbers mean?
Power & electrical5
Vacuum & pumping6
Wafer handling4
Optics & imaging1
Performance1
Control & software1
Dimensions & facilities6
Configuration & options2
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Apogee Benchtop 300 Bake Plate | — | — | Benchtop configuration | costeffectiveequipment.com[3] |
| Apogee Flange Mount 300 Bake Plate | — | — | Flange/deck-mountable configuration | costeffectiveequipment.com[3] |
| Apogee X-Pro 300 Bake Plate | — | — | X-Pro platform for use with X-Pro II Workstation | costeffectiveequipment.com[3] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Voltage208V[2]
- Voltage208-240 VAC[4]
- Power3100-4100 watts[4]
- Exhaust Port2" (50.8mm) OD[4]
- Power208V[5]
- Vacuum2" (50.8mm) OD[5]
- Bake methodscontact, vacuum and proximity[6]
- Power208-230 VAC, 50/60 Hz, 3,669 W (16.3 A) maximum[6]
- Vacuum20 inHg (33 kPa absolute)[6]
- Nitrogen for proximity baking35 psi (241 kPa)[6]
- Exhaust2" OD[6]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What temperature range does the CEE 300 Bake Plate support?
The standard temperature range is ambient to 300°C, with an optional upgrade to 400°C.[3][4]
What bake methods are available?
The plate supports three automated bake methods: contact, vacuum, and proximity.[3][4]
What user interface does the CEE 300 have?
The bake plate features a 7-inch full-color touchscreen with DataStream OS for recipe creation, monitoring, and logging.[3]
Not publicly documented
The following facts about the 300 Bake Plate are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 300 Bake Plate are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 300 Bake Plate are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 300 Bake Plate are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 300 Bake Plate is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 300 Bake Plate are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Inventory photo
- [3]costeffectiveequipment.com — costeffectiveequipment.comcosteffectiveequipment.com
- [4]sistemtechnology.com — sistemtechnology.comsistemtechnology.com
- [5]waferpedia.com — waferpedia.comwaferpedia.com
- [6]sistemtechnology.com — sistemtechnology.comsistemtechnology.com
Last updated Oct 20, 2026.
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