Comparison ledger
Chroma 3650, Rorze 03 RR 8120-001-001 Wafer Exchanger, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3650Chroma | |
|---|---|---|
| OEM | Chroma | Rorze |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Chroma 3650 | Rorze 03 RR 8120-001-001 Wafer Exchanger |
| Specifications | ||
| Pin channels | 512[1] | — |
| Model | 3650[1] | 03 RR 8120-001-001[3] |
| Equipment type | Tester[1] | Wafer Exchanger[3] |
| System type | SoC/Analog Test System[2] | — |
| Digital I/O pins | Up to 640 digital I/O pins[2] | — |
| High-speed clock rate | 50 / 100 MHz[2] | — |
| Data rate | 100 / 200 Mbps (MUX)[2] | — |
| Vector memory | 32 M vector memory[2] | — |
| Pattern instruction memory | 32 M pattern instruction memory[2] | — |
| Per-pin measurement | Per-pin PPMU / frequency measurement[2] | — |
| Edge placement accuracy | ±300 ps[2] | — |
| DPS channels | 32 high-performance DPS channels[2] | — |
| Software platform | CRISP[2] | — |
| Operating system | Microsoft Windows 7 / Windows 10[2] | — |
| Data output | STDF data output[2] | — |
| Cooling | Air-cooled[2] | — |
| Footprint | Small footprint[2] | — |
| Wafer size | — | 8 inch[3] |
| Manufacturer | — | Rorze[3] |
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