Comparison ledger
Despatch AST-1100, YES 450 PB 12 Polyimide, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AST-1100Despatch | |
|---|---|---|
| OEM | Despatch | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Despatch AST-1100 | YES 450 |
| Specifications | ||
| Wafer size | Designed for 300 mm silicon wafers; also suitable for 200 mm wafers[1] | Capacity is two 25 wafer cassettes in a batch process (50 wafers at a time) - 300mm FOUP[3] |
| Tool type | Automated photowhite bake tool[1] | — |
| Tool capacity | 50 wafers with standard two-chamber configuration[1] | — |
| Temperature uniformity | +/-1.0 °C between wafers and across all 25 wafers in the chamber at dunk temperature[1] | +/- 5.0°C at dwell after all temperature points have stabilized for 15 minutes (empty chamber at pressures above 50 torr)[3] |
| Maximum temperature | 175 °C[1] | — |
| Atmosphere | Inert atmosphere[1] | — |
| Cooling | Active cooling for rapid cool down[1] | — |
| Filtration | HEPA filter[1] | — |
| Dimensions | Approximately 262 cm wide and 224 cm long[1] | — |
| Automation features | Supports two front-opening unified pod (FOUP) load stations, a class 1 cleanroom-compatible robot, and an optically based class 1 laser cassette imaging sensor[1] | — |
| Compliance | Meets SEMI S2/S8 and SEMATECH appendices A, B, and C[1] | — |
| Communication standards | Meets 300 mm SEMI communications standards[1] | — |
| Options | FOUP ID reader, 2-level monitoring, wafer ID reader, uninterruptible power supply (UPS)[1] | — |
| Model | AST-1100 Automated Photoresist Bake Tool[1] | 450 PB 12[4] |
| Wafer compatibility | 200mm and 300mm[1] | — |
| Chamber Material | — | 316L Stainless Steel[3] |
| Operation Temperature | — | ambient to 450°C (option high temp version: Ambient to 550°()[3] |
| Process Gas Inputs | — | 1 standard up to 3 optional[3] |
| Configuration | — | Preheated N, (Process Gas)[3] |
| Mass Flow Controllers | — | optional, up to 3[3] |
| Laminar Flow Filter | — | 100 micron Mott'" plate filter[3] |
| Cleanliness | — | particle reduction in most applications[3] |
| OEM | — | YES[4] |
| Category | — | Thermal / Diffusion[4] |
| Capacity | — | Two 25-wafer cassettes in a batch process (50 wafers at a time)[3] |
| FOUP compatibility | — | 300mm FOUP[3] |
| Wafer handling | — | Uses wafer cassette; wafers are manually brought to the machine and loaded inside[3] |
| Operation temperature | — | Ambient to 450°C[3] |
| Gas delivery | — | 1 standard up to 3 optional[4] |
| Process gas | — | Preheated N2[3] |
| Vacuum | — | Alternate vacuum valve for process vacuum[4] |
| Vacuum plumbing | — | VCR[4] |
| Number of Recipes | — | 8 temperature profiles (up to 200 with YES - DAQ-LR option)[3] |
| Temperature | — | Ambient to 450°C with LED temperature and set point displays[3] |
| Voltage | — | 208V, 3 Phase 50/60 Hz, 40 amps[3] |
| Oxygen Concentration | — | 10 ppm over background[3] |
| High-temperature option | — | Ambient to 550°C[3] |
| Power | — | 208V, 3 Phase 50/60 Hz, 40 amps[4] |
| Controller | — | PLC controller[3] |
| Operator interface | — | Color touch screen operator interface[3] |
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