Comparison ledger
Disco 321, Disco DFG 8540 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | DFG 8540 BackDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco DFG |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | 321[1] | DFG 8540[4] |
| Equipment type | Wafer Dicing Saw[1] | Back Grinder[4] |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Wafer Size | Up to 6 inches[2] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] | — |
| Spindle Power (alternate) | 1500 Watt spindle[2] | — |
| Non-Contact Setup | Non Contact Setup[3] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] | — |
| Broken Blade Detection | Broken Blade Detection[3] | — |
| Light Tower | Includes Light Tower[3] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] | — |
| Wafer size capability | Up to 6" wafers[3] | — |
| Chuck | 6-inch porous film frame chuck[2] | — |
| Spindle power | 1500-watt spindle[2] | — |
| Footprint | Small footprint[2] | — |
| Setup | Non-contact setup[3] | — |
| Blade break detection | Broken blade detection[3] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[3] | — |
| Configuration | — | 6" / 8" Universal Table for IGBT Si[4] |
| Voltage | — | 200 VAC[4] |
| Phase | — | 3 Phase[4] |
| Full Load | — | 54 A[4] |
| Make | — | Disco[4] |
| Wafer sizes | — | 6, 8 inch[4] |
| Grinding method | — | Anomalous in-feed grinding with wafer rotation[5] |
| Supported workpiece size | — | Φ8 inch (Φ4, 5, 6, 8 inch with universal chuck table use)[5] |
| Grinding wheels | — | Φ200 mm Diamond Wheel[5] |
| Spindle rated output | — | 4.2 kW[5] |
| Rotation speed range | — | 1,000 to 7,000 min-1[5] |
| Equipment dimensions (W × D × H) | — | 1,200 × 2,670 × 1,800 mm[5] |
| Equipment weight | — | Approx. 3,100 kg[5] |
| Processing capability | — | Large diameter grinding and thin-finish grinding[6] |
| Thin wafer handling | — | Ultra-thin wafer handling to 100 µm and less[6] |
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