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3220versusDFD 651 Fully Automatic Dicing

Disco 3220, Disco DFD 651 Fully Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
3220Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Disco DFD 651 Fully Automatic Dicing
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Fully Automatic Dicing Saw—Yes[3]
Dual 1000W Synchro Spindle—Dual 1000W synchro spindle[3]
Macro/Micro Automatic Alignment—Yes[3]
High Pressure Spinner Cleaning Unit—Yes[3]
Non Contact Setup—Yes[3]
Broken Blade Detector—Yes[3]
Motorized 360° Theta—Yes[3]
Monitor with Camera—12-inch monitor with camera[3]
Chuck Table—8-inch universal chuck table[3]
Manufacturer—Disco[4]
Model—DFD 651[4]
Type—Fully Automatic Dicing Saw[3]
Dual spindle—Dual 1000W synchro spindle[3]
Alignment—Macro/Micro Automatic Alignment[3]
Cleaning unit—High Pressure Spinner Cleaning Unit[3]
Setup—Non Contact Setup[3]
Blade detection—Broken Blade Detector[3]
Theta control—Motorized 360° Theta[3]
Monitor—12" monitor with camera[3]
Chuck table—8" universal chuck table[3]
Blade tools—Included[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]gtsaz.comgtsaz.com
  4. [4]Equipment inventory listing
  5. [5]semistarcorp.comsemistarcorp.com