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Comparison ledger

3220versusMWS 610

Disco 3220, Takatori MWS 610, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
3220Disco
MWS 610Takatori
OEMDiscoTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Takatori MWS 610
Cited variants—
Specifications
equipment typedicing saw[2]—
Workplace sizeø150 mm[3]—
Spindle layoutSingle[3]—
Spindle output1.5 kW at 30,000 min-1[3]—
Spindle max revolution speed40,000 min-1[3]—
X-axis feed speed range0.1 – 500 mm/s[3]—
Y-axis index step0.0001 mm[3]—
Z-axis repeating accuracy0.001 mm[3]—
Z-axis max blade sizeø58 mm[3]—
Manufacturer—Takatori[4]
Model—MWS 610[4]
Machine type—Wire saw[5]
Category—Dicing & Grinding[5]
Application—Dicing and grinding[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]Equipment inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]used-machines.comused-machines.com