Comparison ledger
Disco DFD 6340 Automatic Dicing, Disco DFD 6340 Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DFD 6340 DicingDisco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFD 6340 | Disco DFD 6340 |
| Specifications | ||
| Configuration | Missing ZI motor[1] | 50/60 Hz[7] |
| Phase | 3 Phase[2] | 3 Phase[7] |
| Voltage | 220 Vac[2] | 200 VAC[7] |
| Make | Disco[1] | Disco[10] |
| Model | DFD 6340[1] | DFD 6340[10] |
| Machine type | Automatic dicing saw[1] | — |
| Wafer size | 8 inch[4] | — |
| Electrical configuration | 3 Phase, 3 Wire + Ground, 220 Vac, 50/60 Hz[2] | — |
| Example unit vintage | 2013[1] | — |
| OEM | Disco[1] | — |
| Equipment type | Automatic Dicing Saw[1] | Dicing Saw[10] |
| Electrical | 3 Phase[5] | 200 VAC, 3 Phase, 50/60 Hz[7] |
| Vintage | 2013[1] | — |
| Spindle Power Options | 1.2 / 1.8 / 2.2 kW[6] | — |
| X-axis Cutting Range | 210 mm[6] | — |
| X-axis Cutting Speed | 0.1-600 mm/s[6] | — |
| Y1 / Y2 Axis Cutting Range | 210 mm[6] | — |
| Y-axis Index Step | 0.0001 mm[6] | — |
| Z-axis Repeatability | 0.001 mm[6] | — |
| Main Process | Wafer Dicing / Package Singulation[6] | — |
| Wafer Size | — | 8 inch[10] |
| Spindles | — | Dual[9] |
| Display | — | LCD Touch Screen[8] |
| Cleaning Station | — | Yes[8] |
| CO2 Unit | — | Yes[8] |
| Power | — | 200 VAC, 3 Phase, 50/60 Hz[7] |
| Spindle | — | Dual Spindle (option)[9] |
| Dual Spindle | — | Yes[9] |
| LCD Touch Screen | — | Yes[8] |
| Power Supply | — | 200 VAC, 3 Phase, 50/60 Hz[7] |
| Spindle Configuration | — | Dual Spindle[9] |
| Wafer sizes | — | 8 inch[10] |
| Included features | — | LCD Touch Screen, Cleaning Station, CO2 Unit[8] |
| Included feature | — | Dual Spindle[9] |
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