Comparison ledger
Disco DFD 6340 Automatic Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 15Lapmaster | |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFD 6340 | Lapmaster 15 |
| Specifications | ||
| Configuration | Missing ZI motor[1] | — |
| Phase | 3 Phase[2] | — |
| Voltage | 220 Vac[2] | — |
| Make | Disco[1] | — |
| Model | DFD 6340[1] | — |
| Machine type | Automatic dicing saw[1] | — |
| Wafer size | 8 inch[4] | — |
| Electrical configuration | 3 Phase, 3 Wire + Ground, 220 Vac, 50/60 Hz[2] | — |
| Example unit vintage | 2013[1] | — |
| OEM | Disco[1] | — |
| Equipment type | Automatic Dicing Saw[1] | — |
| Electrical | 3 Phase[5] | — |
| Vintage | 2013[1] | — |
| Spindle Power Options | 1.2 / 1.8 / 2.2 kW[6] | — |
| X-axis Cutting Range | 210 mm[6] | — |
| X-axis Cutting Speed | 0.1-600 mm/s[6] | — |
| Y1 / Y2 Axis Cutting Range | 210 mm[6] | — |
| Y-axis Index Step | 0.0001 mm[6] | — |
| Z-axis Repeatability | 0.001 mm[6] | — |
| Main Process | Wafer Dicing / Package Singulation[6] | — |
| Input Power | — | 110 Vac[7] |
| Plate Diameter | — | 15 inches (381 mm)[8] |
| Number of Conditioning Rings | — | 3[8] |
| Ring ID | — | 5.5 inches (140 mm)[8] |
| Standard RPM | — | 60[8] |
| RPM Range (Variable Speed Drive) | — | 0-60[8] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[8] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[8] |
| Length | — | 25 inches (635 mm)[8] |
| Width | — | 20 inches (508 mm)[8] |
| Height | — | 24 inches (610 mm)[8] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[8] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →