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Comparison ledger

DFD 6362 Automatic Dicingversus15

Disco DFD 6362 Automatic Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFDLapmaster 15
Specifications
Phase3 Phase[1]—
Configuration3 Wire + Ground[1]—
Voltage308 - 415 VAC +/- 10%, 3 Phase[2]—
Full Load Current9 A[3]—
Machine Main Breaker Rating20 A[3]—
Largest Load4 A[3]—
MakeDisco[1]—
ModelDFD 6362[1]—
Equipment typeAutomatic Dicing Saw[3]—
Power3 Phase - 3 Wire + Ground - 50/60 Hz - 200-240 Vac[1]—
Vintage2023[1]—
Frequency50/60 Hz[2]—
TypeFully Automatic Dicing Saw[4]—
Max. workpiece sizeΦ300 mm[4]—
Wafer size300mm[5]—
Electrical phase3 Phase[1]—
Standard spindle1.2 kW spindle[5]—
Optional spindle1.8 kW / 2.2 kW spindle[5]—
Input Power—110 Vac[6]
Plate Diameter—15 inches (381 mm)[7]
Number of Conditioning Rings—3[7]
Ring ID—5.5 inches (140 mm)[7]
Standard RPM—60[7]
RPM Range (Variable Speed Drive)—0-60[7]
Drive Motor - Lapper—0.5 HP (0.37 kW)[7]
Drive Motor - Polisher—0.75 HP (0.56 kW)[7]
Length—25 inches (635 mm)[7]
Width—20 inches (508 mm)[7]
Height—24 inches (610 mm)[7]
Estimated Shipping Weight—285 lbs (129.3 kg)[7]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]disco.co.jpdisco.co.jp
  5. [5]agsemiconductor.comagsemiconductor.com
  6. [6]inventory listing
  7. [7]web.archive.orgweb.archive.org