Comparison ledger
Disco DFG 8540 Back, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DFG 8540 BackDisco | 15Lapmaster |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFG | Lapmaster 15 |
| Specifications | ||
| Configuration | 6" / 8" Universal Table for IGBT Si[1] | — |
| Voltage | 200 VAC[1] | — |
| Phase | 3 Phase[1] | — |
| Full Load | 54 A[1] | — |
| Make | Disco[1] | — |
| Model | DFG 8540[1] | — |
| Equipment type | Back Grinder[1] | — |
| Wafer sizes | 6, 8 inch[1] | — |
| Grinding method | Anomalous in-feed grinding with wafer rotation[2] | — |
| Supported workpiece size | Φ8 inch (Φ4, 5, 6, 8 inch with universal chuck table use)[2] | — |
| Grinding wheels | Φ200 mm Diamond Wheel[2] | — |
| Spindle rated output | 4.2 kW[2] | — |
| Rotation speed range | 1,000 to 7,000 min-1[2] | — |
| Equipment dimensions (W × D × H) | 1,200 × 2,670 × 1,800 mm[2] | — |
| Equipment weight | Approx. 3,100 kg[2] | — |
| Processing capability | Large diameter grinding and thin-finish grinding[3] | — |
| Thin wafer handling | Ultra-thin wafer handling to 100 µm and less[3] | — |
| Input Power | — | 110 Vac[4] |
| Plate Diameter | — | 15 inches (381 mm)[5] |
| Number of Conditioning Rings | — | 3[5] |
| Ring ID | — | 5.5 inches (140 mm)[5] |
| Standard RPM | — | 60[5] |
| RPM Range (Variable Speed Drive) | — | 0-60[5] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[5] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[5] |
| Length | — | 25 inches (635 mm)[5] |
| Width | — | 20 inches (508 mm)[5] |
| Height | — | 24 inches (610 mm)[5] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[5] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →