Comparison ledger
Disco DFL 7160 Automatic, Disco DGP 8760 + DFM 2800, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DFL 7160 AutomaticDisco | DGP 8760 + DFM 2800Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFL 7160 | Disco DGP 8760 |
| Cited variants |
| — |
| Specifications | ||
| Configuration | 1 Cassette port[2] | Fully automatic[4] |
| Wafer Size | 12 inch[2] | — |
| Cassette Ports | 1[2] | — |
| Dicing | Yes[3] | — |
| Circular Ring Cutting of Taiko Wafers | Yes[3] | — |
| Automation | Automatic[1] | Fully automatic[4] |
| Wafer Sizes | — | 8, 12 inch[4] |
| Fully automatic | — | Yes[4] |
| Power | — | 200 Vac, 3 Phase[4] |
| Inline UV irradiation system | — | Present[4] |
| Pre-Cut Dicing Tape | — | Yes[4] |
| Finish thickness min with wafer polishing | — | Up to 50ums[4] |
| Minimum finish thickness with wafer polishing | — | 50 µm[4] |
| Operation type | — | Fully automatic[4] |
| Configuration options | — | Stand-alone BG or in-line with wafer mounter[4] |
| Vintage year | — | 2009[4] |
| Make | — | Disco[4] |
| Model | — | DGP 8760 + DFM 2800[4] |
| Dicing tape | — | Pre-Cut Dicing Tape[4] |
| Finish thickness | — | Up to 50 ums finish thickness min. with wafer polishing[4] |
| Vintage | — | 2009[4] |
| UV system | — | Inline UV irradiation system[4] |
| Tape | — | Pre-Cut Dicing Tape[4] |
| Finish thickness minimum | — | Up to 50 ums with wafer polishing[4] |
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