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Comparison ledger

DFL 7160 AutomaticversusDGP 8761 + DFM 2800 In-Line

Disco DFL 7160 Automatic, Disco DGP 8761 + DFM 2800 In-Line, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFL 7160Disco DGP 8761
Cited variants
  • DFL 7160 Laser Dicing[1]
—
Specifications
Configuration1 Cassette port[2]Fully Automatic[4]
Wafer Size12 inch[2]—
Cassette Ports1[2]—
DicingYes[3]—
Circular Ring Cutting of Taiko WafersYes[3]—
AutomationAutomatic[1]Fully automatic[4]
Make—Disco[4]
Model—DGP 8761 + DFM 2800 In-Line[4]
Machine type—In-Line Grinder[4]
Axis—3 Axis[4]
Chuck table—200 mm/300 mm universal (orientation flat)[4]
Spinner table—200 mm/300 mm universal (orientation flat)[4]
Robot pick—Inline dedicated (200 mm/300 mm wafers dedicated)[4]
Foup opener unit—300 mm wafers dedicated (with 200 mm adapter)[4]
Host communication—SECS-1/-2 and GEM compliant[4]
Vintage—2012 Vintage[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]inventory listing