Waferpedia

Comparison ledger

DFL 7161versus11600 SRD

Disco DFL 7161, Semitool 11600 SRD, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
11600 SRDSemitool
OEMDiscoSemitool
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DFL 7161Semitool 11600 SRD
Specifications
Processing methodAblation[1]—
Max workpiece sizeΦ300 mm[1]—
X-axis Processing range310 mm[1]—
X-axis Moving speed1 - 1000 mm/s[1]—
Y-axis Processing range310 mm[1]—
Y-axis Index step0.0001 mm[1]—
Y-axis Positioning accuracy0.003/310 (Single error) 0.002/5[1]—
Z-axis Moving resolution0.000015 mm[1]—
Z-axis Repeatability accuracy0.002 mm[1]—
θ-axis Max. rotating angle330 deg (standard) 380 deg (option)[1]—
Equipment dimensions (W×D×H)1560 × 1550 × 1800 mm[1]—
Equipment weightApprox. 2300 kg[1]—
Configuration—Ceramic[2]
Manufacturer—Semitool[2]
Model—11600 SRD[2]
Equipment type—Spin Rinse Dryer[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]disco.co.jpdisco.co.jp
  2. [2]inventory listing